LF155/LF156/LF256/LF257/LF355/LF356/LF357
Absolute Maximum Ratings
If Military/Aerospace specified devices are required, contact the National Semiconductor Sales Office/Distributors for
availability and specifications.
LF155/6
Supply Voltage
Differential Input Voltage
Input Voltage Range (Note 2)
Output Short Circuit Duration
T
JMAX
H-Package
N-Package
M-Package
Power Dissipation at T
A
= 25˚C (Notes
1, 8)
H-Package (Still Air)
H-Package (400 LF/Min Air Flow)
N-Package
M-Package
Thermal Resistance (Typical)
θ
JA
H-Package (Still Air)
H-Package (400 LF/Min Air Flow)
N-Package
M-Package
(Typical)
θ
JC
H-Package
Storage Temperature Range
Soldering Information (Lead Temp.)
Metal Can Package
Soldering (10 sec.)
Dual-In-Line Package
Soldering (10 sec.)
Small Outline Package
Vapor Phase (60 sec.)
Infrared (15 sec.)
215˚C
220˚C
215˚C
220˚C
260˚C
260˚C
260˚C
300˚C
300˚C
300˚C
23˚C/W
−65˚C to +150˚C
23˚C/W
−65˚C to +150˚C
23˚C/W
−65˚C to +150˚C
160˚C/W
65˚C/W
160˚C/W
65˚C/W
130˚C/W
195˚C/W
160˚C/W
65˚C/W
130˚C/W
195˚C/W
560 mW
1200 mW
400 mW
1000 mW
670 mW
380 mW
400 mW
1000 mW
670 mW
380 mW
150˚C
115˚C
100˚C
100˚C
115˚C
100˚C
100˚C
LF256/7/LF356B
LF355/6/7
±
22V
±
40V
±
20V
Continuous
±
22V
±
40V
±
20V
Continuous
±
18V
±
30V
±
16V
Continuous
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of
soldering surface mount devices.
ESD tolerance
(100 pF discharged through 1.5kΩ)
1000V
1000V
1000V
DC Electrical Characteristics
Symbol
V
OS
∆V
OS
/∆T
∆TC/∆V
OS
I
OS
Parameter
Input Offset Voltage
Average TC of Input
Offset Voltage
Change in Average TC
with V
OS
Adjust
Input Offset Current
Conditions
Min
R
S
=50Ω, T
A
=25˚C
Over Temperature
R
S
=50Ω
R
S
=50Ω, (Note 4)
T
J
=25˚C, (Notes 3, 5)
T
J
≤T
HIGH
5
0.5
3
20
20
LF155/6
Typ
3
Max Min
5
7
5
0.5
3
20
1
LF256/7
LF356B
Typ
3
Max Min
5
6.5
5
0.5
3
50
2
LF355/6/7
Typ
3
Max
10
13
mV
mV
µV/˚C
µV/˚C
per mV
pA
nA
Units
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