Black Package (No -M Suffix)
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
PIN 1
ID.
PIN 1
ID.
3
2
1
0.270 (6.86)
0.240 (6.10)
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
4
5
6
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
0.016 (0.41)
0.008 (0.20)
0.200 (5.08)
0.115 (2.92)
0.020 (0.51)
MIN
0.016 (0.40) MIN
0.020 (0.51)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
MIN
0.315 (8.00)
MIN
0.016 (0.40)
0.008 (0.20)
0.405 (10.30)
MAX
0.300 (7.62)
TYP
0.022 (0.56)
0.016 (0.41)
0° to 15°
Lead Coplanarity : 0.004 (0.10) MAX
0.100 (2.54)
TYP
Recommended Pad Layout for Surface Mount
Leadform (Black Package Only)
Package Dimensions (0.4” Lead Spacing)
PIN 1 ID
0.070 (1.78)
0.270 (6.86)
0.240 (6.10)
0.060 (1.52)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.350 (8.89)
0.330 (8.38)
0.030 (0.76)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.016 (0.40)
0.008 (0.20)
0.004 (0.10)
MIN
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.400 (10.16)
TYP
0.100 (2.54) TYP
Note:
All dimensions are in inches (millimeters)
10
www.fairchildsemi.com
CNY17X, CNY17FX, MOC810X Rev. 1.0.6
ROCHESTER [ Rochester Electronics ]
