ADSP-BF531/ADSP-BF532/ADSP-BF533
5 Applies to JTAG input pins (TCK, TDI, TMS, TRST).
6 Absolute value.
7 Applies to three-statable pins.
8 Applies to all signal pins.
9 Guaranteed, but not tested.
10See the ADSP-BF533 Blackfin Processor Hardware Reference Manual for definitions of sleep, deep sleep, and hibernate operating modes.
11See Table 16 for the list of IDDINT power vectors covered by various Activity Scaling Factors (ASF).
System designers should refer to Estimating Power for the
ADSP-BF531/BF532/BF533 Blackfin Processors (EE-229), which
provides detailed information for optimizing designs for lowest
power. All topics discussed in this section are described in detail
in EE-229. Total power dissipation has two components:
1. Static, including leakage current
2. Dynamic, due to transistor switching characteristics
Many operating conditions can also affect power dissipation,
including temperature, voltage, operating frequency, and pro-
cessor activity. Electrical Characteristics on Page 23 shows the
current dissipation for internal circuitry (VDDINT). IDDDEEPSLEEP
specifies static power dissipation as a function of voltage
(VDDINT) and temperature (see Table 14 or Table 15), and IDDINT
specifies the total power specification for the listed test condi-
tions, including the dynamic component as a function of voltage
(VDDINT) and frequency (Table 17).
The dynamic component is also subject to an Activity Scaling
Factor (ASF) which represents application code running on the
processor (Table 16).
Table 14. Static Current–500 MHz, 533 MHz, and 600 MHz Speed Grade Devices (mA)1
2
Voltage (VDDINT
)
TJ (°C)2 0.80 V 0.85 V 0.90 V 0.95 V 1.00 V 1.05 V 1.10 V 1.15 V 1.20 V 1.25 V 1.30 V 1.32 V 1.375 V 1.43 V 1.45 V
–45
0
4.3
5.3
5.9
7.0
8.2
9.8
11.2
40.1
72.9
13.0
45.3
80.9
15.2
51.4
90.3
17.7
58.1
20.2
65.0
21.6
68.5
25.5
78.4
30.1
89.8
32.0
94.3
18.8
35.3
52.3
73.6
21.3
39.9
58.5
82.5
24.1
45.0
65.1
92.0
27.8
50.9
73.3
31.6
57.3
81.3
35.6
64.4
90.9
25
101.4 112.1 118.0 133.7 151.6 158.7
40
101.2 112.5 125.5 138.7 154.4 160.6 180.6 203.1 212.0
55
102.7 114.4 126.3 141.2 155.7 172.7 191.1 212.1 220.8 247.6 277.7 289.5
70
100.8 112.5 124.5 137.4 152.6 168.4 186.5 205.4 227.0 250.3 276.2 287.1 320.4 357.4 371.9
133.3 148.5 164.2 180.5 198.8 219.0 241.0 264.5 290.6 319.7 350.2 364.6 404.9 449.7 467.2
178.3 196.3 216.0 237.6 259.9 284.6 311.9 342.0 373.1 408.0 446.1 462.6 511.1 564.7 585.6
223.3 245.9 270.2 295.7 323.5 353.3 386.1 421.1 460.1 500.9 545.0 566.5 624.3 688.1 712.8
278.5 305.8 334.1 364.3 397.4 432.4 470.6 509.3 553.4 600.6 652.1 676.5 742.1 814.1 841.9
85
100
115
125
1 Values are guaranteed maximum IDDDEEPSLEEP specifications.
2 Valid temperature and voltage ranges are model-specific. See Operating Conditions on Page 21.
Table 15. Static Current–400 MHz Speed Grade Devices (mA)1
2
Voltage (VDDINT
)
TJ (°C)2 0.80 V
0.85 V
1.1
0.90 V
1.3
0.95 V
1.5
1.00 V
1.8
1.05 V
2.2
1.10 V
1.15 V
3.1
1.20 V
3.8
1.25 V
4.4
1.30 V
5.0
1.32 V
5.4
–45
0
0.9
2.6
3.3
3.7
4.2
4.8
5.5
6.3
7.2
8.1
8.9
10.1
11.2
11.9
25
7.5
8.4
9.4
10.0
15.9
23.6
35.3
48.6
67.8
91.9
122.1
11.2
17.4
26.0
38.2
52.7
73.2
99.1
130.8
12.6
19.4
28.2
41.7
57.3
78.8
106.6
140.2
14.1
21.5
30.8
45.2
61.7
84.9
114.1
149.7
15.5
23.5
33.7
49.0
66.7
91.5
122.4
160.4
17.2
25.8
36.8
52.8
72.0
98.4
131.1
171.9
19.0
21.2
21.9
40
12.0
18.3
27.7
38.2
54.1
73.9
98.7
13.1
20.0
30.3
41.7
58.1
80.0
106.3
14.3
21.9
32.6
44.9
63.2
86.3
113.8
28.1
30.8
32.0
55
39.8
43.4
45.0
70
57.6
62.4
64.2
85
77.5
83.9
86.5
100
115
125
106.0
140.9
183.8
113.8
151.1
197.0
117.2
155.5
202.4
1 Values are guaranteed maximum IDDDEEPSLEEP specifications.
2 Valid temperature and voltage ranges are model-specific. See Operating Conditions on Page 21.
Rev. H
| Page 24 of 64 | January 2011
ROCHESTER [ Rochester Electronics ]
