ADSP-BF531/ADSP-BF532/ADSP-BF533
t
t
NOM is the duration running at fCCLKNOM
RED is the duration running at fCCLKRED
For further details on the on-chip voltage regulator and related
board design guidelines, see the Switching Regulator Design
Considerations for ADSP-BF533 Blackfin Processors (EE-228)
applications note on the Analog Devices web site (www.ana-
log.com)—use site search on “EE-228”.
The percent power savings is calculated as:
% power savings = 1 – power savings factor 100%
CLOCK SIGNALS
VOLTAGE REGULATION
The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors can
be clocked by an external crystal, a sine wave input, or a buff-
ered, shaped clock derived from an external clock oscillator.
If an external clock is used, it should be a TTL-compatible signal
and must not be halted, changed, or operated below the speci-
fied frequency during normal operation. This signal is
connected to the processor’s CLKIN pin. When an external
clock is used, the XTAL pin must be left unconnected.
The Blackfin processor provides an on-chip voltage regulator
that can generate appropriate VDDINT voltage levels from the
V
DDEXT supply. See Operating Conditions on Page 21 for regula-
tor tolerances and acceptable VDDEXT ranges for specific models.
Figure 7 shows the typical external components required to
complete the power management system. The regulator con-
trols the internal logic voltage levels and is programmable with
the voltage regulator control register (VR_CTL) in increments
of 50 mV. To reduce standby power consumption, the internal
voltage regulator can be programmed to remove power to the
processor core while keeping I/O power (VDDEXT) supplied.
While in the hibernate state, I/O power is still being applied,
eliminating the need for external buffers. The voltage regulator
can be activated from this power-down state either through an
RTC wakeup or by asserting RESET, both of which initiate a
boot sequence. The regulator can also be disabled and bypassed
at the user’s discretion.
Alternatively, because the processors include an on-chip oscilla-
tor circuit, an external crystal can be used. For fundamental
frequency operation, use the circuit shown in Figure 8.
Blackfin
CLKOUT
TO PLL CIRCUITRY
EN
SET OF DECOUPLING
CAPACITORS
V
DDEXT
700ꢀ
(LOW-INDUCTANCE)
V
V
V
DDEXT
DDEXT
DDINT
+
XTAL
CLKIN
100μF
10μH
1Mꢀ
0ꢀ*
100nF
+
+
FOR OVERTONE
18pF*
18pF*
100μF
OPERATION ONLY
FDS9431A
100μF
10μF
LOW ESR
ZHCS1000
VR
VR
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED
DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE
ANALYZE CAREFULLY.
OUT
SHORT AND LOW-
INDUCTANCE WIRE
OUT
Figure 8. External Crystal Connections
NOTE: DESIGNER SHOULD MINIMIZE
TRACE LENGTH TO FDS9431A.
GND
A parallel-resonant, fundamental frequency, microprocessor-
grade crystal is connected across the CLKIN and XTAL pins.
The on-chip resistance between CLKIN and the XTAL pin is in
the 500 k range. Further parallel resistors are typically not rec-
ommended. The two capacitors and the series resistor shown in
Figure 8 fine tune the phase and amplitude of the sine fre-
quency. The capacitor and resistor values shown in Figure 8 are
typical values only. The capacitor values are dependent upon
the crystal manufacturer's load capacitance recommendations
and the physical PCB layout. The resistor value depends on the
drive level specified by the crystal manufacturer. System designs
should verify the customized values based on careful investiga-
tion on multiple devices over the allowed temperature range.
Figure 7. Voltage Regulator Circuit
Voltage Regulator Layout Guidelines
Regulator external component placement, board routing, and
bypass capacitors all have a significant effect on noise injected
into the other analog circuits on-chip. The VROUT1–0 traces
and voltage regulator external components should be consid-
ered as noise sources when doing board layout and should not
be routed or placed near sensitive circuits or components on the
board. All internal and I/O power supplies should be well
bypassed with bypass capacitors placed as close to the proces-
sors as possible.
A third-overtone crystal can be used at frequencies above
25 MHz. The circuit is then modified to ensure crystal operation
only at the third overtone, by adding a tuned inductor circuit as
shown in Figure 8.
Rev. H
| Page 13 of 64 | January 2011
ROCHESTER [ Rochester Electronics ]
