PIN ASSIGNMENTS
PIN # NAME
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
IN1
IN2
REF
AGND
D11
D10
D9
D8
D7
D6
D5
D4
DGND
D3
D2
D1
D0
HBE
DESCRIPTION
±10V
Analog Input. Connected to GND for
±5V
range.
±5V
Analog Input. Connected to GND for
±10V
range.
+2V Reference Output. Bypass to GND with 22µF to
47µF Tantalum. Buffer for external loads.
Analog Ground. Connect to pin 13.
Data Bit 11. Most Significant Bit (MSB).
Data Bit 10.
Data Bit 9.
Data Bit 8.
Data Bit 7 if HBE is LOW; LOW if HBE is HIGH.
Data Bit 6 if HBE is LOW; LOW if HBE is HIGH.
Data Bit 5 if HBE is LOW; LOW if HBE is HIGH.
Data Bit 4 if HBE is LOW; LOW if HBE is HIGH.
Digital Ground. Connect to pin 4.
Data Bit 3 if HBE is LOW; Data Bit 11 if HBE is HIGH.
Data Bit 2 if HBE is LOW; Data Bit 10 if HBE is HIGH.
Data Bit 1 if HBE is LOW; Data Bit 9 if HBE is HIGH.
Data Bit 0 if HBE is LOW. Least Significant Bit (LSB);
Data Bit 8 if HBE is HIGH.
High Byte Enable. When held LOW, data output as 12
bits in parallel. When held HIGH, four MSBs presented on
pins 14-17, pins 9-12 output LOWs. Must be LOW to
initiate conversion.
Read/Convert. Falling edge initiates conversion when CS
is LOW, HBE is LOW, and BUSY is HIGH.
Chip Select. Outputs in Hi-Z state when HIGH. Must be
LOW to initiate conversion or read data.
Busy. Output LOW during conversion. Data valid on rising
edge in Convert Mode.
Negative Power Supply. –12V or –15V. Bypass to GND.
Positive Digital Power Supply. +5V. Connect to pin 24,
and bypass to GND.
Positive Analog Power Supply. +5V. Connect to pin 23,
and bypass to GND.
PIN CONFIGURATION
Top View
DIP/SOIC
IN1
IN2
REF
AGND
D11
D10
D9
D8
D7
D6
D5
D4
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
V
SA
V
SD
–V
S
BUSY
CS
R/C
HBE
D0
D1
D2
D3
DGND
19
20
21
22
23
24
R/C
CS
BUSY
–V
S
V
SD
V
SA
4
ADS7800
www.ti.com
SBAS001A
ROCHESTER [ Rochester Electronics ]
