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ADS7800AH 参数 Datasheet PDF下载

ADS7800AH图片预览
型号: ADS7800AH
PDF下载: 下载PDF文件 查看货源
内容描述: [1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 0.300 INCH, GREEN, HERMETIC SEALED, CERAMIC, SDIP-24]
分类和应用: 转换器
文件页数/大小: 20 页 / 1061 K
品牌: ROCHESTER [ Rochester Electronics ]
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PACKAGE OPTION ADDENDUM  
www.ti.com  
31-Jul-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
ADS7800AH  
NRND  
CDIP SB  
JDN  
24  
16 Green (RoHS &  
no Sb/Br)  
Call TI  
N / A for Pkg Type  
ADS7800AH-BI  
ADS7800BH  
OBSOLETE CDIP SB  
NRND CDIP SB  
JD  
24  
24  
TBD  
Call TI  
Call TI  
Call TI  
JDN  
16 Green (RoHS &  
no Sb/Br)  
N / A for Pkg Type  
ADS7800BH-BI  
ADS7800JP  
OBSOLETE CDIP SB  
JD  
NT  
24  
24  
TBD  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
15 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
ADS7800JU  
ADS7800JU/1K  
ADS7800JU/1KE4  
ADS7800JUE4  
ADS7800KP  
DW  
DW  
DW  
DW  
NT  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
33  
1000  
1000  
33  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
Pb-Free  
(RoHS)  
Pb-Free  
(RoHS)  
Pb-Free  
(RoHS)  
15 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
ADS7800KPG4  
ADS7800KU  
NT  
15 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
DW  
DW  
DW  
DW  
33  
1000  
1000  
33  
Pb-Free  
(RoHS)  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
CU NIPDAU Level-3-260C-168 HR  
ADS7800KU/1K  
ADS7800KU/1KE4  
ADS7800KUE4  
Pb-Free  
(RoHS)  
Pb-Free  
(RoHS)  
Pb-Free  
(RoHS)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
Addendum-Page 1