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ADM211EARU-REEL 参数 Datasheet PDF下载

ADM211EARU-REEL图片预览
型号: ADM211EARU-REEL
PDF下载: 下载PDF文件 查看货源
内容描述: [QUAD LINE TRANSCEIVER, PDSO28, MO-153AE, TSSOP-28]
分类和应用: 驱动光电二极管接口集成电路驱动器
文件页数/大小: 21 页 / 1335 K
品牌: ROCHESTER [ Rochester Electronics ]
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ASM206E/ASM207E/ASM208E/ASM2±±E/ASM2±3E  
On the ADM2±3E, Receiver R4 and Receiver R5 remain  
enabled in shutdown. Note that the transmitters are disabled  
protection structure is shown in Figure 24 and Figure 25. Each  
input and output contains two back-to-back high speed  
but are not tristated in shutdown; it is not permitted to connect  
multiple (RS-232) driver outputs together.  
clamping diodes. During normal operation, with maximum  
RS­232 signal levels, the diodes have no effect because one or  
the other is reverse biased, depending on the polarity of the  
signal. If, however, the voltage exceeds about ±50 V, reverse  
breakdown occurs, and the voltage is clamped at this level. The  
diodes are large p-n junctions designed to handle the  
The shutdown feature is very useful in battery-operated systems  
since it reduces the power consumption to ± μW. During  
shutdown, the charge pump is also disabled. The shutdown  
control input is active high on the ADM2±±E, and it is active  
low on the ADM2±3E. When exiting shutdown, the charge  
pump is restarted, and it takes approximately ±00 μs for it to  
reach its steady state operating condition.  
instantaneous current surges that can exceed several amperes.  
The transmitter outputs and receiver inputs have a similar  
protection structure. The receiver inputs can also dissipate some  
of the energy through the internal 5 kΩ resistor to GND as well  
as through the protection diodes.  
HIGH BAUD RATE  
The ADM2xxE feature high slew rates, permitting data  
transmission rates well in excess of the EIA-232-E  
The protection structure achieves ESD protection up to  
±±5 kV and EFT protection up to ±2 kV on all RS-232 I/O  
lines. The methods used to test the protection scheme are  
discussed in the ESD Testing (IEC ±000­4­2) and EFT/Burst  
Testing (IEC ±000­4­4) sections.  
specifications. RS-232 levels are maintained at data rates up to  
230 kbps, even under worst-case loading conditions. This  
allows for high speed data links between two terminals, making  
it suitable for the new generation modem standards that require  
data rates of 200 kbps. The slew rate is controlled internally to  
less than 30 V/μs to minimize EMI interference.  
R1  
RECEIVER  
RX  
INPUT  
3V  
D1  
EN INPUT  
R
IN  
D2  
0V  
tDR  
VOH  
Figure 24. Receiver Input Protection Scheme  
VOH –0.1V  
RECEIVER  
OUTPUT  
VOL +0.1V  
T
OUT  
TRANSMITTER  
OUTPUT  
RX  
VOL  
D1  
D2  
NOTES  
1. EN IS THE COMPLEMENT OF EN FOR THE ADM213E.  
Figure 22. Receiver Disable Timing  
Figure 25. Transmitter Output Protection Scheme  
3V  
EN INPUT  
ESD TESTING (IEC 1000-4-2)  
0V  
IEC ±000-4-2 (previously IEC 80±-2) specifies compliance  
testing using two coupling methods, contact discharge and air-  
gap discharge. Contact discharge calls for a direct connection to  
the unit being tested. Air-gap discharge uses a higher test voltage  
but does not make direct contact with the unit under test. With  
air-gap discharge, the discharge gun is moved toward the unit  
under test, developing an arc across the air gap. This method is  
influenced by humidity, temperature, barometric pressure,  
distance, and rate of closure of the discharge gun. The contact  
discharge method, while less realistic, is more repeatable and is  
gaining acceptance in preference to the air-gap method.  
tER  
+3.5V  
RECEIVER  
OUTPUT  
+0.8V  
NOTES  
1. EN IS THE COMPLEMENT OF EN FOR THE ADM213E.  
Figure 23. Receiver Enable Timing  
ESD/EFT TRANSIENT PROTECTION SCHEME  
The ADM2xxE use protective clamping structures on all inputs  
and outputs that clamp the voltage to a safe level and dissipate  
the energy present in ESD (electrostatic) and EFT (electrical  
fast transient) discharges. A simplified schematic of the  
Although very little energy is contained within an ESD pulse,  
the extremely fast rise time, coupled with high voltages, can  
cause failures in unprotected semiconductors. Catastrophic  
Rev. E | Page ±± of 20