AD674B/AD774B
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
28-Lead Ceramic DIP Package
(D-28)
0.05 (1.27)
0.045 (1.14)
0.050 (12.83)
28
1
15
30o
0.08 (2.0)
0.59
+
0.01
–
(14.98)
0.125 MIN (3.17)
SEATING
PLANE
14
0.085
(2.16)
+
1.42 (36.07)
1.40 (35.56)
0.145 0.02
–
0.095 (2.41)
(3.68)
+
0.010 0.002
–
+
(0.254 0.05)
0.050
–
+
0.010
–
(1.27)
+
0.1 (2.54)
0.6 (15.24)
0.017 0.003
–
+
0.047 0.007
(0.43)
–
(1.19)
28-Lead Plastic DIP Package
(N-28)
1.565 (39.70)
1.380 (35.10)
28
15
0.580 (14.73)
0.485 (12.32)
1
14
PIN 1
0.060 (1.52)
0.015 (0.38)
0.625 (15.87)
0.600 (15.24)
0.250
0.195 (4.95)
0.125 (3.18)
(6.35)
MAX
0.150
(3.81)
MIN
0.015 (0.381)
0.008 (0.204)
0.200 (5.05)
0.125 (3.18)
0.070
(1.77)
MAX
0.100
(2.54)
BSC
SEATING
PLANE
0.022 (0.558)
0.014 (0.356)
28-Lead Wide Body SOIC Package
(R-28)
0.7125 (18.10)
0.6969 (17.70)
28
15
0.2992 (7.60)
0.2914 (7.40)
0.4193 (10.65)
0.3937 (10.00)
1
14
PIN 1
0.1043 (2.65)
0.0926 (2.35)
0.0291 (0.74)
0.0098 (0.25)
ꢄ 45ꢃ
8ꢃ
0ꢃ
0.0500 0.0192 (0.49) SEATING
0.0118 (0.30)
0.0040 (0.10)
0.0500 (1.27)
0.0157 (0.40)
0.0125 (0.32)
0.0091 (0.23)
PLANE
(1.27)
BSC
0.0138 (0.35)
REV. C
–11–
ROCHESTER [ Rochester Electronics ]
