Thermoelectric Cooling Solutions
Performance Parameters
1MDL06-024-XXt
ΔTmax Qmax
Imax
A
Umax AC R
H
Type
K
W
V
Ohm mm
1MDL06-024-xxt (N=24)
1MDL06-024-03t
1MDL06-024-05t
1MDL06-024-07t
1MDL06-024-09t
1MDL06-024-12t
1MDL06-024-15t
68
71
72
73
73
73
9.23
5.91
4.34
3.43
2.61
2.11
5.2
3.3
2.4
1.9
1.4
1.1
0.43
0.69
0.95
1.21
1.61
2.00
0.9
1.1
1.3
1.5
1.8
2.1
3.0
Performance data are given for 300K, vacuum
Dimensions
Manufacturing options
A. TEC Assembly:
C. Ceramics Surface Options:
D. Thermistor (optional)
* 1. Solder SnSb (Tmelt=230°C)
2. Solder AuSn (Tmelt=280°C)
1. Blank ceramics (not metallized)
2. Metallized (Au plating)
Can be mounted to cold side
ceramics edge. Calibration is
available by request.
3. Metallized and pre-tinned with:
3.1 Solder 117 (In-Sn, Tmelt =117°C)
3.2 Solder 138 (Sn-Bi, Tmelt = 138°C)
3.3 Solder 143 (In-Ag, Tmelt = 143°C)
B. Ceramics:
E. Terminal contacts
1. Blank, tinned Copper
2. Insulated Wires
* 1.Pure Al2O3(100%)
2.Alumina (Al2O3- 96%)
3.Aluminum Nitride (AlN)
* - used by default
3.4 Solder 157 (In, Tmelt = 157°C)
3.5 Solder 183 (Pb-Sn, Tmelt =183°C)
3.6 Optional (specified by Customer)
3. Insulated, color coded
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
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