Thermoelectric Cooling Solutions
Performance Parameters
1MD03-005-XX/1
ΔTmax Qmax
Imax
A
Umax AC R
H
Type
K
W
V
Ohm mm
1MD03-005-xx/1 (N=5)
1MD03-005-04/1
1MD03-005-05/1
1MD03-005-08/1
71
72
73
0.40
0.32
0.21
1.1
0.8
0.5
0.45
0.56
0.89
0.9
1.1
1.4
0.6
Performance data are given for 300K, vacuum
Dimensions
Manufacturing options
A. TEC Assembly:
C. Ceramics Surface Options:
D. Thermistor (optional)
* 1. Solder SnSb (Tmelt=230°C)
2. Solder AuSn (Tmelt=280°C)
1. Blank ceramics (not metallized)
2. Metallized (Au plating)
Can be mounted to cold side
ceramics edge. Calibration is
available by request.
3. Metallized and pre-tinned with:
3.1 Solder 117 (In-Sn, Tmelt =117°C)
3.2 Solder 138 (Sn-Bi, Tmelt = 138°C)
3.3 Solder 143 (In-Ag, Tmelt = 143°C)
B. Ceramics:
E. Terminal contacts
1. Blank, tinned Copper
2. Insulated Wires
* 1.Pure Al2O3(100%)
2.Alumina (Al2O3- 96%)
3.Aluminum Nitride (AlN)
* - used by default
3.4 Solder 157 (In, Tmelt = 157°C)
3.5 Solder 183 (Pb-Sn, Tmelt =183°C)
3.6 Optional (specified by Customer)
3. Insulated, color coded
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
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