RT8284N
Layout Considerations
For best performance of the RT8284N, the following layout
guidelines must be strictly followed.
` Input capacitor must be placed as close to the IC as
possible.
(c) Copper Area = 30mm2 ,θJA = 54°C/W
(d) Copper Area = 50mm2 ,θJA = 51°C/W
(e) Copper Area = 70mm2 ,θJA = 49°C/W
` SW should be connected to inductor by wide and short
trace. Keep sensitive components away from this trace.
` The feedback components must be connected as close
to the device as possible
The feedback components
must be connected as close
to the device as possible.
Input capacitor must be placed
as close to the IC as possible.
SW
V
IN
GND
GND
C
SS
C
C
C
IN
8
7
6
5
BOOT
VIN
SS
V
IN
R
EN
2
3
4
R
C
EN
C
P
GND
SW
COMP
FB
9
C
S
R1
R
S
GND
C
OUT
R2
V
OUT
L1
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
V
OUT
GND
Figure 8. PCB Layout Guide
Figure 6. Themal Resistance vs. CopperArea Layout
Design
Table 3. Suggested Capacitors for CIN and COUT
Location
CIN
Component Supplier
MURATA
TDK
Part No.
Capacitance (μF)
Case Size
1206
GRM31CR61E106K
C3225X5R1E106K
TMK316BJ106ML
GRM31CR60J476M
C3225X5R0J476M
GRM32ER71C226M
C3225X5R1C22M
10
10
10
47
47
22
22
1206
CIN
TAIYO YUDEN
MURATA
TDK
1206
CIN
1206
COUT
COUT
COUT
COUT
1210
MURATA
TDK
1210
1210
Copyright 2012 Richtek Technology Corporation. All rights reserved.
©
is a registered trademark of Richtek Technology Corporation.
DS8284N-03 May 2012
www.richtek.com
13
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