RT7299B 参数 Datasheet PDF下载

RT7299B

Parameter

Power Good Falling

Threshold

Power Good Sink Current

Capability

Power Good Leakage

Current

Minimum VIN for Indicating

PGOOD

Minimum SS/TR Voltage

for Indicating PGOOD

Over-Temperature Protection

Thermal Shutdown

Thermal Shutdown

Hysteresis

T

SD

T

SD

160

--

175

10

--

°C

--

Symbol

Test Conditions

V

FB

Falling (Fault)

V

FB

Falling (Good)

PGOOD signal fault, I

PGOOD

sinks

2mA

PGOOD signal good, V

PGOOD

= 5.5V

V

PGOOD



0.5V, I

PGOOD

sinks 100A

Min

--

--

--

--

--

--

Typ

91

106

--

30

0.6

--

Max

--

-

0.3

100

1

V

2.6

%V

REF

V

nA

Unit

Note 1.

Stresses beyond those listed

“Absolute

Maximum Ratings” may cause permanent damage to the device. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in

the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may

affect device reliability.

Note 2.

θ

JA

is measured at T

A

= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7.

θ

JC

is

measured at the exposed pad of the package.

Note 3.

Devices are ESD sensitive. Handling precaution is recommended.

Note 4.

The device is not guaranteed to function outside its operating conditions.

Copyright

©

2019 Richtek Technology Corporation. All rights reserved.

is a registered trademark of Richtek Technology Corporation.

www.richtek.com

6

DS7299B-05

June 2019