RT7291A/B
Parameter
Power Good Indicator
PGOOD Threshold From Lower
PGOOD Low Hysteresis
PGOOD Low to High Delay
T
PGDLY
Sink 4mA
V
PGOOD
= 5V
I
PGLEAK
V
OUT
rising
V
OUT
falling
85
--
--
--
--
90
10
0.5
--
--
95
--
--
0.4
100
%
%
ms
V
nA
Symbol
Test Conditions
Min
Typ
Max
Unit
PGOOD Sink Current Capability V
PGSINK
PGOOD Leakage Current
Thermal Shutdown
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
T
SD
135
--
150
25
--
--
°C
°C
Note 1.
Stresses beyond those listed
“Absolute
Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2.
θ
JA
is measured at T
A
= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7.
Note 3.
Devices are ESD sensitive. Handling precaution is recommended.
Note 4.
The device is not guaranteed to function outside its operating conditions.
Copyright
©
2018 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
6
DS7291A/B-03 January 2018
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
