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RT7252B 参数 Datasheet PDF下载

RT7252B图片预览
型号: RT7252B
PDF下载: 下载PDF文件 查看货源
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分类和应用:
文件页数/大小: 14 页 / 172 K
品牌: RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
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RT7252A/B  
CIN and COUT Selection  
and audible piezoelectric effects. The high Q of ceramic  
capacitors with trace inductance can also lead to significant  
ringing.  
The input capacitance, CIN, is needed to filter the  
trapezoidal current at the source of the high side MOSFET.  
To prevent large ripple current, a low ESR input capacitor  
sized for the maximum RMS current should be used. The  
RMS current is given by :  
Higher values, lower cost ceramic capacitors are now  
becoming available in smaller case sizes. Their high ripple  
current, high voltage rating and low ESR make them ideal  
for switching regulator applications. However, care must  
be taken when these capacitors are used at input and  
output. When a ceramic capacitor is used at the input  
and the power is supplied by a wall adapter through long  
wires, a load step at the output can induce ringing at the  
input, VIN. At best, this ringing can couple to the output  
and be mistaken as loop instability. At worst, a sudden  
inrush of current through the long wires can potentially  
cause a voltage spike at VIN large enough to damage the  
part.  
V
V
V
IN  
V
OUT  
OUT  
I
= I  
1  
RMS  
OUT(MAX)  
IN  
This formula has a maximum at VIN = 2VOUT, where IRMS  
=
IOUT/2. This simple worst-case condition is commonly used  
for design because even significant deviations do not offer  
much relief. Choose a capacitor rated at a higher  
temperature than required. Several capacitors may also  
be paralleled to meet size or height requirements in the  
design. For the input capacitor, a 10μF low ESR ceramic  
capacitor is recommended. For the recommended  
capacitor, please refer to table 3 for more details. The  
selection of COUT is determined by the required ESR to  
minimize voltage ripple. Moreover, the amount of bulk  
capacitance is also a key for COUT selection to ensure  
that the control loop is stable. Loop stability can be  
checked by viewing the load transient response as  
described in a later section. The output ripple, ΔVOUT , is  
determined by :  
Checking Transient Response  
The regulator loop response can be checked by looking  
at the load transient response. Switching regulators take  
several cycles to respond to a step in load current. When  
a load step occurs, VOUT immediately shifts by an amount  
equal to ΔILOAD (ESR) also begins to charge or discharge  
COUT generating a feedback error signal for the regulator  
to return VOUT to its steady-state value. During this  
recovery time, VOUT can be monitored for overshoot or  
ringing that would indicate a stability problem.  
1
VOUT  I ESR   
L   
8fCOUT  
The output ripple will be highest at the maximum input  
voltage since ΔIL increases with input voltage. Multiple  
capacitors placed in parallel may be needed to meet the  
ESR and RMS current handling requirement.Dry tantalum,  
special polymer, aluminum electrolytic and ceramic  
capacitors are all available in surface mount packages.  
Special polymer capacitors offer very low ESR value.  
However, it provides lower capacitance density than other  
types. Although Tantalum capacitors have the highest  
capacitance density, it is important to only use types that  
pass the surge test for use in switching power supplies.  
Aluminum electrolytic capacitors have significantly higher  
ESR. However, it can be used in cost-sensitive applications  
for ripple current rating and long term reliability  
considerations. Ceramic capacitors have excellent low  
ESR characteristics but can have a high voltage coefficient  
Thermal Considerations  
For continuous operation, do not exceed absolute  
maximum junction temperature. The maximum power  
dissipation depends on the thermal resistance of the IC  
package, PCB layout, rate of surrounding airflow, and  
difference between junction and ambient temperature. The  
maximum power dissipation can be calculated by the  
following formula :  
PD(MAX) = (TJ(MAX) TA) / θJA  
where TJ(MAX) is the maximum junction temperature, TAis  
the ambient temperature, and θJA is the junction to ambient  
thermal resistance.  
Copyright 2018 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
www.richtek.com  
12  
DS7252A/B-02 June 2018