RT6340
Parameter
Thermal Shutdown
Thermal Shutdown
Symbol
Test Conditions
Min
Typ
Max
Unit
TSD
TSD
--
--
175
15
--
--
°C
°C
Thermal Shutdown
Hysteresis
Output Under-Voltage Protection
UVP Trip Threshold VUVP
UVP detect
--
0.4
--
V
Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution is recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θJA and θJC are measured or simulated at TA = 25°C based on the JEDEC 51-7 standard.
ψ ψ
(Top) and JB are measured on a high effective-thermal-conductivity four-layer test board which is in size of
JC
Note 5. θJA
,
(EVB)
70mm x 50mm, furthermore, outer layers with 2 OZ. Cu and inner layers with 1 OZ. Cu. Thermal resistance/parameter
values may vary depending on the PCB material, layout, and test environmental conditions.
Copyright 2019 Richtek Technology Corporation. All rights reserved.
©
is a registered trademark of Richtek Technology Corporation.
DS6340-00 September 2019
www.richtek.com
13
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