RT6296D
Layout Considerations
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Four-Layer PCB
For best performance of the RT6296D, the following
layout guidelines must be strictly followed.
Input capacitor must be placed as close to the IC as
possible.
SW should be connected to inductor by wide and
short trace. Keep sensitive components away from
this trace.
Keep every trace connected to pin as wide as
possible for improving thermal dissipation.
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 3. Derating Curve of Maximum Power
Dissipation
SW should be connected to inductor by Wide and
short trace. Keep sensitive components away from
this trace. Suggestion layout trace wider for thermal.
SW
V
BOOT
GND
OUT
EN/SYNC
PVCC
SW
VIN
SS
C
IN C
OUT
C
OUT
R5
R2
FB
R1
C
IN
V
OUT
Via can help to reduce
power trace and improve
thermal dissipation.
Css
GND
The feedback components
must be connected as close
to the device as possible.
Input capacitor must be placed as close
to the IC as possible. Suggestion layout
trace wider for thermal.
Figure 4. PCB Layout Guide
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
12
DS6296D-02 June 2016
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
