RT6264A/B
Parameter
Thermal Shutdown
Thermal Shutdown
Threshold
Thermal Shutdown
Hysteresis
T
SD
T
SD
--
--
155
35
--
°C
--
Symbol
Test Conditions
Min
Typ
Max
Unit
Note 1.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2.
Devices are ESD sensitive. Handling precaution is recommended.
Note 3.
The device is not guaranteed to function outside its operating conditions.
Note 4.
θ
JA
and θ
JC
are measured or simulated at T
A
= 25C based on the JEDEC 51-7 standard.
Note 5.
θ
JA(EVB)
, Ψ
JC(TOP)
and Ψ
JB
are measured on a high effective-thermal-conductivity four-layer test board which is in size of
70mm x 50mm; furthermore, all layers with 1 oz. Cu. Thermal resistance/parameter values may vary depending on the
PCB material, layout, and test environmental conditions.
Copyright © 2019 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
DS6264A/B-01
December 2019
www.richtek.com
9
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
