RT6255A/B
The feedback components must be
connected as close to the device as
possible.
C
VIA
OUT
V
OUT
The R component must
EN
R1
C
OUT
be connected to V
.
IN
R
R2
PGOOD
Suggestion layout trace
wider for thermal.
PGOOD
BOOT
FB
EN
Keep sensitive components away
from this trace. Suggestion layout
trace wider for thermal.
R
EN
V
IN
C
BOOT
VIA
AGND
GND
LX
LX should be connected to inductor by Wide and
short trace. Keep sensitive components away from
this trace. Suggestion layout trace wider for thermal.
The AGND is suggested
VIN
connect to second layer GND
plate by via to get better noise
immunity.
C
C
IN
IN
Input capacitor must be placed as close
to the IC as possible. Suggestion layout
trace wider for thermal.
GND plate
VIA
(Top layer)
Suggestion layout trace
wider for thermal.
GND plate
(2nd layer)
Figure 9. PCB LayoutGuide for TOST-23-8 package
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is a registered trademark of Richtek Technology Corporation.
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18
DS6255A/B-02 March 2017
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
