RT6253A/B
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Thermal Shutdown
Thermal Shutdown
Threshold
TSD
TSD
--
--
155
35
--
--
°C
Thermal Shutdown
Hysteresis
Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θJA and θJC are measured or simulated at T = 25C based on the JEDEC 51-7 standard.
A
Note 5. θJA(EVB), ΨJC(TOP) and ΨJB are measured on a high effective-thermal-conductivity four-layer test board which is in size of
70mm x 50mm; furthermore, all layers with 1 oz. Cu. Thermal resistance/parameter values may vary depending on the
PCB material, layout, and test environmental conditions.
Copyright © 2019 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
DS6253A/B-01 September 2019
www.richtek.com
11
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
