RT6251A/B
Parameter
Power Good
Power Good Rising
Threshold
Power Good Falling
Threshold
Power Good Sink Current
Capability
Power Good Leakage
Current
Minimum VIN for Indicating
PGOOD
Minimum SS/TR Voltage for
Indicating PGOOD
Over-Temperature Protection
Thermal Shutdown
Thermal Shutdown
Hysteresis
T
SD
T
SD
160
--
175
10
--
--
°C
V
FB
Rising (Good)
V
FB
Rising (Fault)
V
FB
Falling (Fault)
V
FB
Falling (Good)
PGOOD signal fault, I
PGOOD
sinks
2mA
PGOOD signal good, V
PGOOD
= 5.5V
V
PGOOD
0.5V, I
PGOOD
sinks 100A
--
--
--
--
--
--
--
--
94
109
91
106
--
30
0.6
--
--
--
--
-
0.3
100
1
V
2.6
%V
REF
%V
REF
V
nA
Symbol
Test Conditions
Min
Typ
Max
Unit
Note 1.
Stresses beyond those listed
“Absolute
Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2.
θ
JA
is measured at T
A
= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7.
θ
JC
is
measured at the exposed pad of the package.
Note 3.
Devices are ESD sensitive. Handling precaution is recommended.
Note 4.
The device is not guaranteed to function outside its operating conditions.
Copyright
©
2015 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
6
DS6251A/B-00 November 2015
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
