RT6239A/B
Connect IC Pin Trace as wide as possible for thermal consideration
AGND must be
Add via for thermal consideration
V
IN
connected clear ground.
R
EN
C
SS
The feedback components
must be connected as close
to the device as possible.
14 13
12
R2
R1
1
2
3
11
AGND
FB
GND
10
GND
V
OUT
9
PVCC
PGOOD
GND
4
8
5V
VIN
Internal Regulator Output.
Connect a 1µF capacitor to GND
to stabilize output voltage.
5
6
7
V
IN
C
IN
GND
Power Good Indicator
Open-Drain Output.
Keep sensitive components
away from this C
Top Layer
.
BOOT
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace .
V
OUT
Figure 8. PCB LayoutGuide (Top Layer)
Add via for thermal consideration
VIN
GND
Bottom Layer
Figure 9. PCB Layout Guide (Bottom Layer)
Copyright 2016 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
©
DS6239A/B-04 May 2016
www.richtek.com
19
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