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RT4531 参数 Datasheet PDF下载

RT4531图片预览
型号: RT4531
PDF下载: 下载PDF文件 查看货源
内容描述: [Dual Channel 10s2p WLED Drivers]
分类和应用:
文件页数/大小: 14 页 / 195 K
品牌: RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
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RT4531  
Thermal Considerations  
Layout Consideration  
For continuous operation, do not exceed absolute  
maximum operation junction temperature. The maximum  
power dissipation depends on the thermal resistance of  
IC package, PCB layout, the rate of surroundings airflow  
and temperature difference between junction to ambient.  
The maximum power dissipation can be calculated by  
following formula :  
For best performance of the RT4531, the following  
guidelines must be strictly followed.  
Input and Output capacitors should be placed close to  
the IC and connected to ground plane to reduce noise  
coupling.  
The GND and Exposed Pad should be connected to a  
strong ground plane for heat sinking and noise protection.  
PD(MAX) = ( TJ(MAX) TA ) / θJA  
Keep the main current traces as possible as short and  
Where TJ(MAX) is the maximum operation junction  
temperature, TA is the ambient temperature and the θJAis  
the junction to ambient thermal resistance.  
wide.  
SW node of DC/DC converter is with high frequency  
voltage swing. It should be kept at a small area.  
For recommended operating condition specifications, the  
maximum junction temperature is 125°C. The junction to  
ambient thermal resistance, θJA, is layout dependent. For  
WL-CSP-9B 1.35x1.35 (BSC) package, the thermal  
resistance, θJA, is 81.5°C/W on the standard JEDEC 51-  
7 four-layer thermal test board. The maximum power  
dissipation at TA = 25°C can be calculated by following  
formula :  
It recommended to separate the ISET line and PWM  
line that avoid the PWM signal couple to ISET.  
PD(MAX) = (125°C 25°C) / (81.5°C/W) = 1.22W for  
WL-CSP-9B 1.35x1.35 (BSC) package  
The maximum power dissipation depends on operating  
ambient temperature for fixed TJ(MAX) and thermal  
resistance θJA. The derating curve in Figure 3 of derating  
curves allows the designer to see the effect of rising  
ambient temperature on the maximum power allowed.  
1.6  
Four-Layer PCB  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0
25  
50  
75  
100  
125  
Ambient Temperature (°C)  
Figure 3.Derating Curve of Maximum PowerDissipation  
Copyright 2016 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
DS4531-01 July 2016  
www.richtek.com  
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