RT2810A/B
Layout Consideration
Follow the PCB layout guidelines for optimal performance of the device.
Keep the traces of the main current paths as short and wide as possible.
Put the input capacitor as close as possible to VIN and VIN pins.
SW node is with high frequency voltage swing and should be kept at small area. Keep analog components away from
the SW node to prevent stray capacitive noise pickup.
Connect feedback network behind the output capacitors. Keep the loop area small. Place the feedback components
near the device.
Connect all analog grounds to common node and then connect the common node to the power ground behind the
output capacitors.
An example of PCB layout guide is shown in Figure 10 and Figure 11 for reference.
Internal Regulator Output. Connect a 1µF
capacitor to GND to stabilize output voltage.
The R resistor must be connected
RT
as close to the device as possible.
Keep sensitive components away.
The feedback components must be
connected as close to the device as possible.
R2
R1
AGND must be connected clear ground.
V
C
OUT
SS
Input capacitor must be placed
as close to the IC as possible.
The R
resistor must be connected
LIM
as close to the device as possible.
Keep sensitive components away.
R
LIM
RLIM
EN
V
C
VIN
GND
IN
V
IN
IN
R
EN
SW
GND
SW
The R component
EN
must be connected.
PGOOD
R
PGOOD
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace .
C
BOOT
L
C
OUT
Connect IC Pin Trace as wide as
possible for thermal consideration
Add via for thermal consideration
V
OUT
Power Good Indicator
Open-Drain Output.
Keep sensitive components
away from this C
Top Layer
.
BOOT
Figure 10. PCB LayoutGuide (Top Layer)
Copyright 2016 Richtek Technology Corporation. All rights reserved.
©
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
16
DS2810A/B-06 November 2016
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
