RT2517B
Absolute Maximum Ratings
(Note 1)
Supply Voltage, VIN ------------------------------------------------------------------------------------------------------
−0.3V
to 7V
Other Pins -------------------------------------------------------------------------------------------------------------------
−0.3V
to 6V
Power Dissipation, P
D
@ T
A
= 25°C
SOP-8 (Exposed Pad) --------------------------------------------------------------------------------------------------- 2.041W
Package Thermal Resistance (Note 2)
SOP-8 (Exposed Pad),
θ
JA
---------------------------------------------------------------------------------------------- 49°C/W
SOP-8 (Exposed Pad),
θ
JC
--------------------------------------------------------------------------------------------- 8°C/W
Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C
Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
Storage Temperature Range --------------------------------------------------------------------------------------------
−65°C
to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Model) ---------------------------------------------------------------------------------------------- 2kV
(Note 4)
Recommended Operating Conditions
Supply Input Voltage, VIN ----------------------------------------------------------------------------------------------- 2.2V to 6V
Junction Temperature Range --------------------------------------------------------------------------------------------
−40°C
to 125°C
Electrical Characteristics
(V
IN
= 2.2V to 6V, I
OUT
= 10μA to 1A, V
ADJ
= V
OUT
,
−40°C ≤
T
A
≤
105°C, unless otherwise specified)
Parameter
Shutdown Supply Current
Quiescent Current
Line Regulation
Load Regulation
Current Limit
Current Foldback Threshold
Dropout Voltage
ADJ Reference Voltage
ADJ Pin Current
EN Input Voltage
Enable Pin Current
Logic-High
Logic-Low
Symbol
I
SHDN
I
Q
V
LINE
V
LOAD
I
LIM
V
Fold
V
DROP
V
ADJ
I
ADJ
V
IH
V
IL
I
EN
Test Conditions
V
IN
= 3.3V, V
EN
= 0V
V
IN
= 3.3V, I
OUT
= 0A
I
OUT
= 10mA
I
OUT
= 10mA to 1A
V
IN
= 3.3V
V
IN
= 3.3V
I
OUT
= 1A,
V
IN
= 3.3V
V
IN
= 3.3V
V
IN
= 3.3V
V
IN
= 6V, V
EN
= 0V
Min
--
--
--
--
1.05
0.3
--
--
1.6
--
--
--
--
Typ
1
0.7
--
--
--
--
--
1.2
--
--
--
--
160
10
Max
10
1.5
0.4
1
2.8
0.5
400
1.224
400
--
0.4
1
--
--
Unit
A
mA
%/V
%
A
V
mV
V
nA
V
A
C
C
V
IN
= 3.3V, V
ADJ
= V
OUT
, I
OUT
= 10mA 1.176
Thermal Shutdown Temperature T
SD
Thermal Shutdown Hysteresis
T
SD
Note 1.
Stresses beyond those listed under
“Absolute
Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Note 2.
θ
JA
is measured at T
A
= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7.
θ
JC
is
measured at the exposed pad of the package. The PCB copper area with exposed pad is 70mm
2
.
Note 3.
Devices are ESD sensitive. Handling precaution is recommended.
Note 4.
The device is not guaranteed to function outside its operating conditions.
Copyright
©
2018 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
4
DS2517B-05
September 2018