RP1202
For recommended operating conditions specification of
RP1202, where T
J(MAX)
is the maximum junction
temperature of the die (125°C) and T
A
is the maximum
ambient temperature. The junction to ambient thermal
resistance (θ
JA
is layout dependent) for SOT-23-5 package
is 250°C/W on standard JEDEC 51-3 thermal test board.
The maximum power dissipation at T
A
= 25°C can be
calculated by following formula:
P
D(MAX)
= (125°C−25°C) / 333 = 300mW (SC-70-5)
P
D(MAX)
= (125°C−25°C) / 250 = 400mW (SOT-23-5)
The maximum power dissipation depends on operating
ambient temperature for fixed T
J(MAX)
and thermal
resistance
θ
JA
.
RP1202-03 February 2009
9
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
