RT8271
The feedback components
must be connected as close
to the device as possible.
C
SS
SW
C
C
C
BOOT
NC
BOOT
NC
VIN
SW
10
9
SS
EN
COMP
FB
R
C
C
2
3
4
5
P
8
GND
V
IN
7
11
R1
C
6
GND
IN
D1
V
OUT
R2
Input capacitor must
be placed as close
to the IC as possible.
L1
C
OUT
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
V
GND
OUT
Figure 4. PCB LayoutGuide for MSOP-10 (Exposed Pad)
SW
GND
V
IN
C
S
CB
The parallel distance between
COMP and FB traces must be
SS as short as possible.
C
IN
Input capacitor must
be placed as close
to the IC as possible.
8
BOOT
VIN
2
3
4
7
6
5
EN
C
C
D1
SW
COMP
C
OUT
GND
FB
C
P
R
C
L1
The output capacitor
V
must be placed near
the RT8271.
OUT
GND
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
V
OUT
The resistor divider must be connected
as close to the device as possible.
Figure 5. PCB LayoutGuide for SOP-8
www.richtek.com
12
DS8271-02 March 2011
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
