RT8298
Parameter
Sync Frequency Range
EN Turn-Off Delay
EN Pull Low Current
Thermal Shutdown
Thermal Shutdown Hysteresis
Power Good Threshold Rising
Power Good Threshold Hysteresis
Power Good Pin Level
BG Driver Bias Supply Voltage
Gate Driver Sink Impedance
Gate Driver Source Impedance
V
CC
R
Sink
R
Source
PGOOD Sink 10mA
T
SD
ΔT
SD
Symbol
f
Sync
t
OFF
V
EN
= 2V
Test Conditions
Min
0.3
--
--
--
--
--
--
--
4.5
--
--
Typ
--
10
1
150
20
0.75
40
--
5
0.9
3.3
Max
1.5
--
--
--
--
--
--
0.125
--
--
--
Unit
MHz
μs
μA
°C
°C
V
mV
V
V
Ω
Ω
Note 1.
Stresses beyond those listed
“Absolute
Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2.
θ
JA
is measured at T
A
= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7.
θ
JC
is
measured at the exposed pad of the package.
Note 3.
Devices are ESD sensitive. Handling precaution is recommended.
Note 4.
The device is not guaranteed to function outside its operating conditions.
Copyright
©
2011 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
6
DS8298-01
November 2011
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
