RT8289
Parameter
Shutdown Current
Quiescent Current
Soft-Start Period
Thermal Shutdown
T
SD
I
Q
Symbol
I
SHDN
Test Conditions
V
EN
= 0V
V
EN
= 2V, V
FB
= 1.5V
Min
--
--
--
--
Typ
25
0.8
4
150
Max
--
1
--
--
Unit
μA
mA
ms
°C
Note 1.
Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2.
The low side MOSFET body diode forward current must be lower than 1mA
Note 3.
θ
JA
is measured in the natural convection at T
A
= 25°C on a high effective four layers thermal conductivity test board of
JEDEC 51-7 thermal measurement standard. The measurement case position of
θ
JC
is on the exposed pad of the
package.
Note 4.
Devices are ESD sensitive. Handling precaution is recommended.
Note 5.
The device is not guaranteed to function outside its operating conditions.
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4
DS8289-01 March 2011
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
