Preliminary
RF2352
Application Schematic
VCC
1 nF
10 nH
4 pF
50 Ω µstrip
RF OUT
16
15
14
1
2
3
4
5
13
12
11
10
9
VCC
22 nF
RF IN
1 nF
VCC
4
1500 Ω
50 Ω µstrip
1 nF
6
7
8
1 nF
Package base serves as die flag ground. The vias
connecting the backside of the board should be
large in diameter to allow for easier soldering.
MODE SELECT
Evaluation Board Schematic
(Download Bill of Materials from www.rfmd.com.)
VCC
C6
L1
1 nF
10 nH
50 Ω µstrip
J2
RF OUT
16
15
14
C5
4 pF
1
2
3
4
5
13
12
11
10
9
C1
22 nF
50 Ω µstrip
VCC
J1
RF IN
C4
1 nF
R1
1500 Ω
VREF
50 Ω µstrip
C2
1 nF
6
7
8
2352400-
C3
1 nF
R2*
0 Ω
R4*
0 Ω
PD
P1
P2
1
50 Ω µstrip
1
2
PD
NC
GND
VREF
2
GND
VCC
*
R2, R3 and R4 form a "Tee" attenuator network which
determines the gain in the bypass mode. Evaluation
boards are shipped with R2 and R4 as 0 Ω jumpers, and
R3 omitted. This configuration provides the maximum
gain (about -4 dB) available in bypass mode.
R3*
*
OMIT
3
3
CON3
CON3
Package base serves as die flag ground. The vias
connecting the backside of the board should be large in
diameter to allow for easier soldering.
4-180
Rev A4 010720
RFMD [ RF MICRO DEVICES ]
