RF2196
Pin
1
Function
GND
Description
This pin is internally grounded to the die flag.
Interface Schematic
Power Down control for first stage. Regulated voltage supply for amplifier
2
VREG1
bias. In Power Down mode, both V
and V
need to be LOW (<0.5V).
REG
MODE
For nominal operation (High Gain Mode), V
HIGH, the driver and final are dynamically scaled to reduce the device size
and as a result to reduce idle current.
is set LOW. When set
3
4
MODE
MODE
Power Down control for the second stage. Regulated voltage supply for
amplifier bias. In Power Down mode, both V
VREG2
and V
need to be LOW
REG
MODE
(<0.5V).
Connect to ground plane via 15nH inductor. DC return for the second stage
bias circuit.
5
6
GND
NC
This pin has no internal bonding; therefore, this pin can be connected to
output pin 7, connected to the ground plane, or not connected. Slight tun-
ing of the output match may be required due to stray capacitance of the
pin.
RF output and power supply for final stage. This is the unmatched collector
output of the second stage. A DC block is required following the matching
components. The biasing may be provided via a parallel L-C set for reso-
nance at the operating frequency of 1710MHz to 1910MHz. It is important
to select an inductor with very low DC resistance with a 1A current rating.
Alternatively, shunt microstrip techniques are also applicable and provide
very low DC resistance. Low frequency bypassing is required for stability.
7
RF OUT
RF OUT
From Bias
Network
Same as pin 7.
See pin 7.
8
9
RF OUT
GND
This pin is internally grounded to the die flag.
Supply for bias reference and control circuits. High frequency bypassing
may be necessary.
10
VCC
Power supply for first stage and interstage match. Pins 11 and 12 should
be connected by a common trace where the pins contact the printed circuit
board.
11
VCC1
Same as pin 11.
12
13
VCC1
NC
It is recommended that these pins be connected to the ground plane for
improved isolation between RF IN (pin 16) and the VCC1 pins (pins 11 and
12).
It is recommended that these pins be connected to the ground plane for
improved isolation between RF IN (pin 16) and the VCC1 pins (pins 11 and
12).
14
15
16
NC
NC
It is recommended that these pins be connected to the ground plane for
improved isolation between RF IN (pin 16) and the VCC1 pins (pins 11 and
12).
RF input. An external 15pF series capacitor is required as a DC block. In
addition, the matching circuit shown is required to improve input VSWR.
RF IN
VCC1
GND1
15 pF
TL
RF IN
3.6 pF
From
Bias
Stages
Ground connection. The backside of the package should be soldered to a
top side ground pad which is connected to the ground plane with multiple
vias. The pad should have a short thermal path to the ground plane.
Pkg
Base
GND
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
4 of 12
Rev A3 DS070730
RFMD [ RF MICRO DEVICES ]
