Preliminary
RF2192
Pin
1
2
3
4
Function Description
Interface Schematic
Ground connection.
Ground connection.
Ground connection.
GND
GND
GND
RF IN
RF input. An external 100pF series capacitor is required as a DC block.
In addition, shunt inductor and series capacitor are required to provide
2:1VSWR.
VCC1
100 pF
RF IN
2
From
Bias
Stages
GND1
Power Down control for first stage. Regulated voltage supply for ampli-
5
6
7
VREG1
VMODE
VREG2
fier bias. In Power Down mode, both V
and V
need to be LOW
REG
MODE
(<0.5V).
For nominal operation (High Power Mode), V
is set LOW. When
MODE
set HIGH, the driver and final stage are dynamically scaled to reduce
the device size and as a result to reduce the idle current.
Power Down control for the second stage. Regulated voltage supply for
amplifier bias. In Power Down mode, both V
and V
need to be
REG
MODE
LOW (<0.5V).
Bias circuitry ground. See application schematic.
Ground connection.
8
9
BIAS GND
GND
RF output and power supply for final stage. This is the unmatched col-
lector output of the second stage. A DC block is required following the
matching components. The biasing may be provided via a parallel L-C
set for resonance at the operating frequency of 824MHz to 849MHz. It
is important to select an inductor with very low DC resistance with a 1A
current rating. Alternatively, shunt microstrip techniques are also appli-
cable and provide very low DC resistance. Low frequency bypassing is
required for stability.
10
RF OUT
RF OUT
From Bias
Stages
Same as pin 10.
Same as pin 10.
See pin 10.
11
12
13
RF OUT
RF OUT
2FO
Harmonic trap. This pin connects to the RF output but is used for pro-
viding a low impedance to the second harmonic of the operating fre-
quency. An inductor or transmission line resonating with an on chip
capacitor at 2fo is required at this pin.
Power supply for bias circuitry. A 100pF high frequency bypass capaci-
tor is recommended.
14
VCC BIAS
Power supply for first stage.
Same as Pin 15.
15
16
Pkg
Base
VCC1
VCC1
GND
Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with mul-
tiple vias. The pad should have a short thermal path to the ground
plane.
Rev A1 010830
2-207
RFMD [ RF MICRO DEVICES ]
