RF2138
Pin
1
Function Description
Interface Schematic
Not connected. Connect this pin to the ground plane for compatibility
with future packages.
NC
Ground connection for the driver stage. To minimize the noise power at See pin 15.
the output, it is recommended to connect this pin with a trace of about
40mil to the ground plane. This will slightly reduce the small signal
gain, and lower the noise power. It is important for stability that this pin
have it’s own vias to the ground plane, minimizing common inductance.
2
3
GND2
2
RF Input. This is a 50Ω input, but the actual impedance depends on the
interstage matching network connected to pin 5. An external DC block-
VCC1
GND1
RF IN
ing capacitor is required if this port is connected to a DC path to ground
or a DC voltage.
RF IN
From Bias
Stages
Ground connection for the pre-amplifier stage. Keep traces physically
short and connect immediately to the ground plane for best perfor-
mance. It is important for stability that this pin has it’s own vias to the
groundplane, to minimize any common inductance.
See pin 3.
4
5
6
GND1
VCC1
APC1
Power supply for the pre-amplifier stage and interstage matching. This See pin 3.
pin forms the shunt inductance needed for proper tuning of the inter-
stage match. Refer to the application schematic for proper configura-
tion. Note that position and value of the components are important.
Power Control for the driver stage and pre-amplifier. When this pin is
APC VCC
"low," all circuits are shut off. A "low" is typically 0.5V or less at room
temperature. A shunt bypass capacitor is required. During normal oper-
ation this pin is the power control. Control range varies from about 1.0V
for -10dBm to 2.6V for +35dBm RF output power. The maximum power
that can be achieved depends on the actual output matching; see the
application information for more details. The maximum current into this
To RF
Stages
pin is 5mA when V
=2.6V, and 0mA when V
=0V.
APC1
APC
GND
GND
Power Control for the output stage. See pin 6 for more details.
Power supply for the bias circuits.
See pin 6.
See pin 6.
7
8
9
APC2
VCC
NC
Not connected. Connect this pin to the ground plane for compatibility
with future packages.
RF Output and power supply for the output stage. Bias voltage for the
final stage is provided through this wide output pin. An external match-
ing network is required to provide the optimum load impedance.
10
RF OUT
RF OUT
GND
From Bias
Stages
PCKG BASE
Same as pin 10.
Same as pin 10.
Same as pin 10.
Same as pin 10.
Same as pin 10.
11
12
13
RF OUT
RF OUT
2F0
Connection for the second harmonic trap. This pin is internally con-
nected to the RF OUT pins. The bonding wire together with an external
capacitor form a series resonator that should be tuned to the second
harmonic frequency in order to increase efficiency and reduce spurious
outputs.
Not connected.
14
15
NC
VCC2
VCC2
GND2
Power supply for the driver stage and interstage matching. This pin
forms the shunt inductance needed for proper tuning of the interstage
match. Please refer to the application schematic for proper configura-
tion, and note that position and value of the components are important.
From Bias
Stages
Same as pin 15.
Same as pin 15.
16
Pkg
Base
VCC2
GND
Ground connection for the output stage. This pad should be connected
to the ground plane by vias directly under the device. A short path is
required to obtain optimum performance, as well as to provide a good
thermal path to the PCB for maximum heat dissipation.
2-122
Rev A9 011031
RFMD [ RF MICRO DEVICES ]
