CGA-3318Z
Pin
1
Function
RF IN
Description
Device 1. RF input pin. This pin requires the use of an external DC-blocking capacitor as shown in the schematic.
Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as
possible.
2, 3
GND
Device 2. RF input pin. This pin requires the use of an external DC-blocking capacitor as shown in the schematic.
4
5
RF IN
RF OUT/VCC
Device 2. RF output and bias pin. Bias should be supplied to this pin through an external series resistor and RF
choke inductor. Because DC biasing is present on this pin, a DC-blocking capacitor should be used in most appli-
cations. The supply side of the bias network should be well bypassed.
Same as pins 2 and 3.
6, 7
8
EPAD
GND
RF OUT/VCC
GND
Device 1. Same as pin 5.
Exposed area on the bottom side of the package must be soldered to the ground plane of the board for optimum
thermal and RF performance. Several vias should be located under the EPAD as shown in the recommended
land pattern.
Device Pin Out
1
2
3
4
8
7
6
5
Suggested Pad Layout
PCB Pad Layout
Dimensions in inches [millimeters]
Sized for 31 mil thick FR-4
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support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
DS091119
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RFMD [ RF MICRO DEVICES ]
