8-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
M
N
L
N
J
K
J
I
J
Min
2.87
2.87
-
0.79
0.62
0.47
0.47
1.07
I
K
O
O
mm
Nom
3.00
3.00
-
0.92
0.75
0.60
0.60
1.20
3.19
0.81
0.96
0.81
1.39
0.23
0.38
Max
3.13
3.13
1.10
1.05
0.88
0.73
0.73
1.33
Min
0.113
0.113
-
0.031
0.024
0.018
0.018
0.042
Inches
Nom
0.118
0.118
-
0.036
0.029
0.024
0.024
0.047
0.126
0.032
0.038
0.032
0.055
0.009
0.015
Max
0.123
0.123
0.043
0.041
0.034
0.029
0.029
0.052
PCB Footprint Top View
Case Materials
Materials
Solder Pad
Plating
5 p F
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
2.0 to 3.0 µm Nickel
Al
2
O
3
Ceramic
Pb Free
7
5 0 o h m
In p u t
2
S F 2 1 7 7 E
1 , 3 , 4 , 6 , 8
5
1 8 n H
1 0 0 o h m
B a la n c e d
O u tp u t
Lid Plating
Body
5 p F
TOP VIEW
B
8
1
7
H
A
2
6
6
C
7
BOTTOM VIEW
E
8
1
2
G
3
4
5
5
4
D
F
3
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©2010 by RF Monolithics, Inc.
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SF2177E - 8/4/10
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