SM3838-8 Thin Case
8-Terminal Ceramic Surface-Mount Case
3.8 X 3.8 mm Nominal Footprint
Case Dimensions
Dimension
A
B
C
D
E
F
G
H
0.029 TYP.
(O.74)
Min
3.6
3.6
0.90
0.80
0.90
0.50
2.39
1.40
mm
Nom
3.8
3.8
1.00
0.90
1.00
0.60
2.54
1.75
Max
4.0
4.0
1.1
1.0
1.10
0.70
2.69
2.05
Min
0.142
0.142
0.035
0.031
0.035
0.020
0.090
0.055
Inches
Nom
0.150
0.150
0.040
0.035
0.040
0.024
0.100
0.069
Max
0.157
0.157
0.043
0.040
0.043
0.028
0.110
0.080
0.066
(1.68)
Electrical Connections
Connection
Port 1
Differential Input
Port 2
Differential Output
Ground
Single Ended Operation
Differential Operation
Dot Indicates Pin 1
Terminals
1, 2
5, 6
All Others
Return is Ground
Return is Hot
0.050 TYP.
(1.27)
0.002
(0.05)
0.090
(2.29)
0.033
(0.84)
Materials
0.055 TYP.
(1.40)
Solder Pad Ter- Au plating 30 - 60 uInches (76.2-152 uM) over 80-200
mination
uInches (203-508 uM) Ni.
Lid
Body
Pb Free
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phospho-
rus) 100-200 uInches Thick
Al
2
O
3
Ceramic
PCB Footprint
TOP VIEW
B
8
C
E
BOTTOM VIEW
8
H 7
6
5
1
A
2
3
7
1
2
3
G
YWWS
4
827
6
5
4
D
F
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©2009 by RF Monolithics, Inc.
Page 4 of 5
SF2079D1 - 4/17/09
RFM [ RF MONOLITHICS, INC ]
