SMP-75 Case
10-Terminal Ceramic Surface-Mount Case
19 x 6.5 mm Nominal Footprint
Case Dimensions
Dimension
A
B
C
D
E
H
P
Min
18.80
6.30
mm
Nom
19.00
6.50
1.75
2.29
1.02
1.0
1.905
Max
19.30
6.80
2.00
Min
0.740
0.248
Inches
Nom
0.748
0.256
0.069
0.090
0.040
0.039
0.075
Max
0.760
0.268
0.079
Electrical Connections
Connection
Port 1
Port 2
Hot
Ground Return
Hot
Ground Return
Case Ground
Single Ended Operation
Differential Operation
Terminals
10
1
5
6
All others
Return is ground
Return is hot
Materials
Solder Pad
Termination
Lid
Body
Pb Free
Au plating 30 - 60 µinches (76.2-152 µm) over 80-200
µinches (203-508 µm) Ni.
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phos-
phorus) 100-200 µinches Thick
Al
2
O
3
Ceramic
B
C
H
D
P (8 Places)
6
7
A
8
9
10
5
4
3
2
1
5
4
3
2
1
6
7
8
9
10
E (10 Places)
TOP VIEW
BOTTOM VIEW
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©2008 by RF Monolithics, Inc.
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SF2069A-1 - 6/26/08
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