199.0 MHz
SAW Filter
Solder Temperature Profile
Figure 1 shows the recommended temperature profile for reflow soldering SMP-03 and SMP53-S packages. The
package consists of a ceramic base with a metal lid that is attached with high-temperature solder. The filter pack-
age is hermetically sealed and the solder seal must not be compromised with excessive heat in assembly. It is crit-
ical that the filter package is never heated above 250°C. It is recommended that the package be heated no higher
than 240°C for no more than 10 seconds.
Reflow Soldering Profile (SN63)
250
Peak temperature: 210 to 235 deg C
200
Liquidus: 183 deg C
Temperature (deg C)
150
Pre-drying: 120 to 150 deg C
100
50
Time above liquidus ~ 30 seconds
1
2
3
Minutes
4
5
Figure 1
RF Monolithics, Inc.
Phone: (972) 233-2903
Fax: (972) 387-8148
RFM Europe
Phone: 44 1963 251383
Fax: 44 1963 251510
©1999 by RF Monolithics, Inc. The stylized RFM logo are registered trademarks of RF Monolithics, Inc.
E-mail: info@rfm.com
http://www.rfm.com
SF2027B-041403
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RFM [ RF MONOLITHICS, INC ]
