SMP-03-S Case
Pb
12-Terminal Ceramic Surface-Mount Case
5 x 7 mm Nominal Footprint
Case Dimensions
Dimension
Min
A
B
C
D
E
H
J
K
P
6.80
4.80
mm
Nom
7.00
5.00
1.65
0.80
2.54
1.1
2.54
3.00
1.27
Inches
Max
7.20
5.20
2.00
2.67
1.13
3.13
1.40
Min
0.268
0.189
Nom
0.276
0.197
0.065
0.100
0.039
0.118
0.050
Max
0.283
0.205
0.079
0.105
0.044
0.123
0.055
2.41
0.87
2.87
1.14
0.095
0.034
0.113
0.045
Materials
Solder Pad
Termination
Lid
Body
Pb Free
Au plating 30 - 60 µinches (76.2-152 µm) over 80-
200 µinches (203-508 µm) Ni.
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phos-
phorus) 100-200 µinches Thick
Al
2
O
3
Ceramic
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E-mail: info@rfm.com
©2008 by RF Monolithics, Inc.
Page 3 of 3
SF1141B-4 - 3/28/08