Surface Mount PPTC
FSMD 1812 Series
THERMAL PRODUCT DIMENSIONS (MILLIMETERS)
Thermal Derating Curve, FSMD Series
Percent of Rated Hold and Trip
Current
200%
RoHS
ü
150%
100%
50%
A
B
A= FSMD 075, 110, 110-16, 125, 150
160 & 200
B= FSMD 014, 020, 035 & 050
0%
40
-
20
-
0
20
40
60
80
Ambient Temperature (C)
TYPICAL TIME-TO-TRIP AT 23°C
A = FSMD014
A B
100
C
D E FGH I J
B = FSMD020
C = FSMD035
D = FSMD050
E = FSMD075
F = FSMD110/110-16
G = FSMD125
H = FSMD150
10
Time-to-trip (S)
1
0.1
0.01
0.001
0.1
1
Fault current (A)
10
100
I = FSMD160
J
FSMD200
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimensions in the table below provide the recommended pad layout for each FSMD 1812 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
260 °C
SOLDER RELOW
20 to 40 Seconds
Ramp-up
3°C/Second Max
Ramp-down
6°C/Second Max
3.5
217 °C
f
200 °C
150 °C
Preheat
1.78
3.45
1.78
25 °C
60 to 180 Seconds
60 to 150 Seconds
Solder Reflow
Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned by using standard industry methods and solvents.
5. Storage Environment: <30°C / 60%RH
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Rework:
Use standard industry practices.
RFE International
• Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com
C5ED04
REV 2007.8.14
RFE [ RFE INTERNATIONAL ]
