Surface Mount PPTC
FSMD1210 Series
THERMAL DERATING CURVE
Thermal Derating Curv e, FSMD1210 Serie s
200%
RoHS
ü
Percent of Rated Hold and Trip
Current
150%
100%
50%
0%
-40
-20
0
20
40
60
80
Ambient Temperature (C)
TYPICAL TIME-TO-TRIP AT 23°C
B
100
10
C
D E
F
Time-to-trip (S)
1
0.1
0.01
A
A=
B=
C=
D=
E=
F=
FSMD005-1210
FSMD010-1210
FSMD020-1210
FSMD035-1210
FSMD050-1210
FSMD075-1210
0.001
0.1
1
Fault current (A)
10
100
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimension in the table below provide the recommended pad layout for each FSMD1210 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
SOLDER REFLOW
20 to 40 Seconds
260 °C
Ramp-up
3°C/Second Max
Ramp-down
6°C/Second Max
2.80
217 °C
f
200 °C
150 °C
Preheat
1.0
2.0
1.0
25 °C
60 to 180 Seconds
60 to 150 Seconds
Solder Reflow
Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned by using standard industry methods and solvents.
5. Storage Environment: <30°C / 60%RH
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Rework:
Use standard industry practices.
NOTE: All Specification subject to change without notice.
RFE International
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C5ED03
REV 2007.8.14
RFE [ RFE INTERNATIONAL ]
