Surface Mount PPTC
FSMD 0805 Series
THERMAL PRODUCT DIMENSIONS (MILLIMETERS)
Thermal Derating Curve, FSMD0805 Series
200%
RoHS
ü
Percent of Rated Hold and Trip
Current
150%
100%
50%
A= FSMD 075, 100
B= FSMD 014, 020, 035 & 050
40
-
20
-
0
20
40
60
80
0%
Ambient Temperature (C)
TYPICAL TIME-TO-TRIP AT 23°C
A
100
10
Time-to-trip (S)
B
C
1
0.1
0.01
0.001
0.1
1
Fault current (A)
10
A = FSMD010 - 0805
B = FSMD020 - 0805
C = FSMD035 - 0805
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimensions in the table below provide the recommended pad layout for each FSMD 1812 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
SOLDER RELOW
Solder Reflow
Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for regular.
This may cause damage to other components.
1. Recommended maximum past thickness is 0.25mm.
2. Devices can be cleaned by using standard industry methods and solvents.
3. Storage Environment: <30°C / 60% RH solvents.
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Devices are not designed to be wave soldered to the bottom side of the board.
Rework:
Use standard industry practices.
NOTE: All Specification subject to change without notice.
RFE International
• Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com
C5ED01
2008.1.30
RFE [ RFE INTERNATIONAL ]
