MIL-PRF-19500/355M
NOTES:
1. Chip size.................................................
2. Chip thickness ........................................
3. Top metal ...............................................
4. Back metal..............................................
.015 x .019 inch
±.001
inch (0.381 x 0.4826 mm ±0.0254 mm).
.010
±.0015
inch (0.254 ±0.0381 mm).
Aluminum 15,000Å minimum, 18,000Å nominal.
A. Gold 2,500Å minimum, 3,000Å nominal.
B. Eutectic Mount - No Gold.
5. Backside................................................. Collector.
6. Bonding pad ........................................... B = .003 inch (0.0762 mm), E = .004 inch (0.1016 mm) diameter.
7. Passivation ............................................. Si
3
N
4
(Silicon Nitride) 2 kÅ min, 2.2 kÅ nom.
FIGURE 3. Physical dimensions (JANHCA and JANKCA die).
5
RAYTHEON [ RAYTHEON COMPANY ]
