1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88739
01
Q
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
Generic number
TMC208KV
TMC208KV1
TMC28KUV
TMC28KUV1
LMU0860
LMU0845
LMU8U60
LMU8U45
Circuit function
Two’s complement 8 x 8 multiplier
Two’s complement 8 x 8 multiplier
Unsigned magnitude 8 x 8 multiplier
Unsigned magnitude 8 x 8 multiplier
Two’s complement 8 x 8 multiplier
Two’s complement 8 x 8 multiplier
Unsigned magnitude 8 x 8 multiplier
Unsigned magnitude 8 x 8 multiplier
Multiply time
70 ns
50 ns
70 ns
50 ns
60 ns
45 ns
60 ns
45 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Q
X
Descriptive designator
GDIP1-T40 or CDIP2-T40
CQCC1-N44
Terminals
40
44
Package style
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range (V
DD
) ............................................................................................
DC voltage applied to outputs:
Devices 01, 02, 03, 04 ...............................................................................................
Devices 05, 06, 07, 08 ...............................................................................................
DC input voltage:
Devices 01, 02, 03, 04 ...............................................................................................
Devices 05, 06, 07, 08 ...............................................................................................
Maximum power dissipation (P
D
) ...................................................................................
Lead temperature (soldering 10 seconds) .....................................................................
Junction temperature (T
J
) ..............................................................................................
Thermal resistance, junction to case (θ
JC
) .....................................................................
Storage temperature range (T
STG
) .................................................................................
-0.5 V dc to +7.0 V dc
-0.5 V dc to V
DD
+0.5 V dc
-3.0 V dc to +7.0 V dc
-0.5 V dc to V
DD
+0.5 V dc
-3.0 V dc to +7.0 V dc
550 mW 1/
300°C
175°C
See MIL-STD-1835
-65°C to +150°C
________
1/ Must withstand the added P
D
due to short circuit test; e.g., I
OS
.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88739
SHEET
G
2
RAYTHEON [ RAYTHEON COMPANY ]
