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SM25609ARDT4-7.5 参数 Datasheet PDF下载

SM25609ARDT4-7.5图片预览
型号: SM25609ARDT4-7.5
PDF下载: 下载PDF文件 查看货源
内容描述: [Synchronous DRAM Module, 32MX72, 5.4ns, CMOS, DIMM-168]
分类和应用: 动态存储器内存集成电路
文件页数/大小: 15 页 / 256 K
品牌: RAMTRON [ RAMTRON INTERNATIONAL CORPORATION ]
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168-pin Low Profile Registered SDRAM DIMMs  
256MB, 512MB, 1GB  
Preliminary Data Sheet  
Serial Presence Detect (SPD) for Registered SDRAM DIMMs  
256MB  
512MB  
1GB  
256MB 512MB 1GB  
Byte # Description  
** HEX CODE **  
0
1
2
3
Number of bytes written into EEPROM  
128  
256  
SDRAM  
12  
128  
128  
80  
08  
04  
0C  
0C  
0B  
0A  
02  
02  
48  
00  
01  
75  
54  
02  
80  
04  
08  
04  
08  
01  
8F  
04  
06  
01  
01  
1F  
07  
A0  
60  
00  
00  
14  
0F  
14  
2D  
40  
20  
15  
08  
15  
08  
00  
12  
F2  
DA  
80  
08  
04  
0D  
0D  
0B  
0A  
02  
02  
48  
00  
01  
75  
54  
02  
82  
04  
08  
04  
08  
01  
8F  
04  
06  
01  
01  
1F  
07  
A0  
60  
00  
00  
14  
0F  
14  
2D  
80  
40  
15  
08  
15  
08  
00  
12  
35  
FD  
80  
08  
04  
0D  
0D  
0B  
00  
02  
02  
48  
00  
01  
75  
54  
02  
82  
04  
Total number of SPD bytes  
Memory Type  
256  
SDRAM  
256  
SDRAM  
Number of Row Addresses  
x4 based  
x8 based  
x4 based  
x8 based  
x4 based  
x8 based  
13  
13  
12  
11  
13  
11  
-
11  
4
5
Number of Column Addresses  
Number of Module Banks  
10  
1
10  
1
-
2
2
2
-
6
7
8
9
Module Data Width  
x72  
0
x72  
0
x72  
0
Module Data Width (cont'd)  
Voltage Interface Levels  
Cycle Time at max CAS Latency  
LVTTL  
7.5 ns  
5.4 ns  
LVTTL  
7.5 ns  
LVTTL  
7.5 ns  
5.4 ns  
10 SDRAM Clock Access Time (CL=3)  
11 DIMM config (non-parity, parity, ECC)  
12 Refresh Rate and Type  
5.4 ns  
--- ECC ---  
15.6 us /self  
7.8 us /self  
7.8 us /self  
x4  
13 Primary SDRAM Width  
x4 based  
x8 based  
x4 based  
x8 based  
x4  
x8  
x4  
x8  
14 Error Checking Data Width  
x4  
x8  
x4  
x8  
x4  
04  
15 Min. CAS-to-CAS Delay (tCCD)  
16 Burst Lengths Supported  
17 Number of Banks on SDRAM Device  
18 CAS Latencies Supported  
19 CS Latency  
1 clk  
1 clk  
1 clk  
01  
8F  
04  
06  
01  
01  
1F  
07  
A0  
60  
00  
00  
14  
0F  
14  
2D  
80  
--- 1,2,4,8,Full Pg ---  
4
2,3  
0
4
2,3  
0
4
2,3  
0
20 Write Latency  
0
0
0
21 SDRAM Module Attributes  
22 SDRAM Device Attributes  
--- Registered/buffered w/ PLL ---  
+/-10% Vdd, Precharge All  
23 Min. Clock Cycle Time at CL=2  
24 Clock Access Time at CL=2 (tAC2)  
25 Min. Clock Cycle Time at CL=1  
26 Clock Access Time at CL=1 (tAC1)  
27 Min. Row Precharge Time (tRP)  
28 Min. Row-to-Row Delay (tRRD)  
29 Min. RAS-to-CAS Delay (tRCD)  
30 Min. RAS Pulse Width (tRAS)  
31 Density of each bank on module  
10 ns  
6.0 ns  
N/A  
10 ns  
6.0 ns  
N/A  
10 ns  
6.0 ns  
N/A  
N/A  
N/A  
N/A  
20 ns  
15 ns  
20 ns  
45 ns  
256MB  
128MB  
20 ns  
15 ns  
20 ns  
45 ns  
20 ns  
15 ns  
20 ns  
45 ns  
x4 based  
x8 based  
512MB  
256MB  
1.5 ns  
0.8 ns  
1.5 ns  
0.8 ns  
-
512MB  
-
32 Cmd/Addr input set-up time  
33 Cmd/Addr input hold time  
34 Data input set-up time  
35 Data input hold time  
36-61 Superset Information  
62 SPD Rev.  
15  
08  
15  
08  
00  
12  
36  
1.2  
63 Checksum for bytes 0-62  
x4 based  
x8 based  
64-71 JEDEC ID code  
Enhanced Memory Systems  
7F32FFFFFFFFFFFF  
72 Manufacturing Location  
73-90 Manufacturer's Part #  
xx  
xx  
xx  
xx  
xx  
xx  
xx  
xx  
x4 based SM25609ARDT4  
x8 based SM25609ARDT8  
SM51209BRDT4  
SM51209BRDT8  
SM1K09BRDT4  
91,92 PCB Rev. Code  
93,94 Manufacturing Date  
rrrr  
yyww  
ssss  
00  
rrrr  
yyww  
ssss  
00  
rrrr  
yyww  
ssss  
00  
yyww code  
serial number  
open  
95-98 Assembly Serial #  
99-125 Manufacturer's Specific Data  
126 Intel specification frequency  
127 Intel specification CL and clock support  
128-255 Open for Customer Use  
100MHz  
64  
64  
64  
87  
00  
87  
00  
87  
00  
Enhanced Memory Systems Inc., 1850 Ramtron Dr., Colo Spgs, CO 80921  
PHONE: (800) 545-DRAM; FAX: (719) 488-9095; http://www.edram.com  
2001 Enhanced Memory Systems. All rights reserved.  
The information contained herein is subject to change without notice.  
Page 12  
Revision 1.1