FM25L256 Extended Temp.
Mechanical Drawing
8-pin SOIC (JEDEC MS-012 variation AA)
Recommended PCB Footprint
7.70
3.70
3.90
±
0.10 6.00 ±0.20
2.00
1.27
Pin 1
0.65
D
0.25
0.50
E
4.90 ±0.10
1.35
1.75
0.19
0.25
°
45
D
S
N
0.10 mm
1.27
N
0.10
0.25
0°- 8°
0.40
1.27
G
0.33
0.51
ME
I
Refer to JEDEC MS-012 for complete dimensions and notes.
B
S
All dimensions in millimeters.
6
M
5
E
2
O
L
D
5
C
2
SOIC Package Marking Scheme
E
M
W
Legend:
F
R
:
XXXX= part number, P= package (S, G, DG), T= temp (C=comm., blank=ind.)
E
e
LLLLLLL= lot code
XXXXXX-PT
LLLLLLL
RICYYWW
v
RIC=Ramtron Int’l Corp, YY=year, WW=work week
i
T
F
N
t
a
Example: FM25L256, Standard SOIC package, Extended temperature, Year 2005,
O
n
Work Week 39
FM25L256-S
r
R
e
N
t
A40003S
l
O
RIC0539
A
Rev. 2.3
March 2007
Page 12 of 14
RAMTRON [ RAMTRON INTERNATIONAL CORPORATION ]
