4.6 Small Outline (SO) Package
D
L
ß×45º
e
2a
W
ø
E
M
Base level
Seating level
h H
Package Type: 14 Pin SOIC
Millimeters
Inches
Max
SYMBOL
Min
Max
Notes
Min
Notes
M
W
2a
H
h
8.56
5.79
3.81
1.35
0.10
1.27
0.36
0.41
0.20
0.25
0
8.81
6.20
3.99
1.75
0.25
1.27
0.51
1.27
0.25
0.51
8
0.337
0.228
0.150
0.31
0.347
0.244
0.157
0.33
0.004
0.050
0.014
0.016
0.008
0.014
0
0.010
0.050
0.020
0.050
0.010
0.020
8
D
L
BSC
BSC
E
e
B
o
4.7 TSSOP Package
E
E1
D
2
1
n
a
B
A
c
A1
L
Units
Dimension Limits
Number of Pins
Pitch
INCHES
MILLIMETERS
MIN
NOM
14
MAX
MIN
NOM
14
MAX
n
p
0.026
0.65
Overall Height
A
0.043
0.006
0.256
0.177
0.201
0.028
8
1.10
0.15
6.50
4.50
5.10
0.70
8
Standoff
A1
E
0.002
0.246
0.169
0.193
0.020
0
0.004
0.251
0.173
0.197
0.024
4
0.05
6.25
4.30
4.90
0.50
0
0.10
6.38
4.40
5.00
0.60
4
Overall Width
Moulded Package Width
Moulded Package Length
Foot Length
E1
D
L
Foot Angle
Lead Thickness
Lead Width
c
B
a
0.004
0.007
0
0.006
0.010
5
0.008
0.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Mould Draft Angle Top
Mould Draft Angle Bottom
0
5
10
0
5
10
lQ
11
QT510 R6.04/0505
QUANTUM [ QUANTUM RESEARCH GROUP ]
