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HYB39SC128800FE 参数 Datasheet PDF下载

HYB39SC128800FE图片预览
型号: HYB39SC128800FE
PDF下载: 下载PDF文件 查看货源
内容描述: 128兆位同步DRAM [128-MBit Synchronous DRAM]
分类和应用: 动态存储器
文件页数/大小: 20 页 / 1127 K
品牌: QIMONDA [ QIMONDA AG ]
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Internet Data Sheet  
HY[B/I]39SC128[800/160]FE  
128-MBit Synchronous DRAM  
1
Overview  
This chapter lists all main features of the product family HY[B/I]39S128[800/160]FE and the ordering information.  
1.1  
Features  
Fully Synchronous to Positive Clock Edge  
0 to 70 °C Operating Temperature for HYB...  
-40 to 85 °C Operating Temperature for HYI...  
Four Banks controlled by BA0 & BA1  
Data Mask for Read / Write control (×8)  
Data Mask for Byte Control (×16)  
Auto Refresh (CBR) and Self Refresh  
Power Down and Clock Suspend Mode  
4096 refresh cycles / 64 ms (15.6 µs)  
Random Column Address every CLK (1-N Rule)  
Single 3.3 V ± 0.3 V Power Supply  
LVTTL Interface  
Programmable CAS Latency: 2 & 3  
Programmable Wrap Sequence: Sequential or Interleave  
Programmable Burst Length: 1, 2, 4, 8 and full page  
Multiple Burst Read with Single Write Operation  
Automatic and Controlled Precharge Command  
Plastic Packages: PG–TSOPII–54 400 mil width  
TABLE 1  
Performance  
Product Type Speed Code  
–6  
–7  
Unit  
Speed Grade  
PC166–333  
PC133–222  
Max. Clock Frequency  
@CL3  
@CL2  
fCK3  
tCK3  
tAC3  
tCK2  
tAC2  
166  
6
143  
7
MHz  
ns  
5.4  
7.5  
5.4  
5.4  
7.5  
5.4  
ns  
ns  
ns  
1.2  
Description  
The HY[B/I]39S128[800/160]FE are four bank Synchronous  
DRAM’s organized as 16 MBit ×8 and 8 Mbit ×16  
output circuits are synchronized with the positive edge of an  
externally supplied clock.  
respectively. These synchronous devices achieve high speed  
data transfer rates for CAS latencies by employing a chip  
architecture that prefetches multiple bits and then  
synchronizes the output data to a system clock. The chip is  
fabricated with Qimonda advanced 0.11 µm 128-MBit DRAM  
process technology.  
Operating the four memory banks in an interleave fashion  
allows random access operation to occur at a higher rate than  
is possible with standard DRAMs. A sequential and gapless  
data rate is possible depending on burst length, CAS latency  
and speed grade of the device.  
Auto Refresh (CBR) and Self Refresh operation are  
supported. These devices operate with a single 3.3 V ± 0.3 V  
power supply. All 128-Mbit components are available in PG–  
TSOPII–54 packages.  
The device is designed to comply with all industry standards  
set for synchronous DRAM products, both electrically and  
mechanically. All of the control, address, data input and  
Rev. 1.1, 2007-02  
3
09072006-N4GC-EREN