Internet Data Sheet
HYB25D512[40/16/80]0B[E/F/C/T](L)
Double-Data-Rate SDRAM
5
Package Outlines
There are two package types used for this product family each in lead-free and lead-containing assembly:
• P-TFBGA: Plastic Thin Fine-Pitch Ball Grid Array Package
TABLE 23
TFBGA Common Package Properties (non-green/green)
Description
Size
Units
Ball Size
0.460
0.350
0.450
mm
mm
mm
Recommended Landing Pad
Recommended Solder Mask
•
P-TSOPII: Plastic Thin Small Outline Package Type II
FIGURE 4
Package Outline of P-TFBGA-60-[9/22] (green/non-green)
12
11 x 1 = 11
0.18 MAX.
1
0.2
2)
B
2)
4)
3)
1) 5)
A
0.1
C
0.1
C
60x
ø0.15
ø0.08
±0.05
ø0.46
M
M
A B
C SEATING PLANE
C
1) Dummy Pads without Ball
2) Middle of Packages Edges
3) Package Orientation Mark A1
4) Bad Unit Marking (BUM)
5) Die Sort Fiducial
GPA09554
Rev. 1.63, 2006-09
33
03062006-PFFJ-YJY2
QIMONDA [ QIMONDA AG ]
