Internet Data Sheet
HYB25DC128[800/160]C[E/F]
128-Mbit Double-Data-Rate SDRAM
5
Package Outlines
There are two package types used for this product family in lead-free assembly:
•
•
PG-TSOPII: Plastic Thin Small Outline Package Type II
PG-TFBGA: Plastic Thin Fine-Pitch Ball Grid Array Package
FIGURE 4
Package Outline of PG-TSOPII-66
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TABLE 22
TFBGA Common Package Properties
Description
Size
Units
Ball Size
0.460
0.350
0.450
mm
mm
mm
Recommended Landing Pad
Recommended Solder Mask
Rev. 1.1, 2007-01
27
03062006-JXUK-E7R1
QIMONDA [ QIMONDA AG ]
