Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
TABLE 3
Ordering Information for Lead-Containing Products
Product Type1)
Oganization CAS-RCD-RP Clock (MHz) Speed
Latencies
Package
Note
Standard Temperature Range (0 °C - +70 °C)
HYB25D256400CT–5 ×4
HYB25D256800CT–5 ×8
HYB25D256160CT–5 ×16
HYB25D256400CT–6 ×4
HYB25D256800CT–6 ×8
HYB25D256800CTL–6 ×8
HYB25D256160CT–6 ×16
HYB25D256400CT–7 ×4
HYB25D256400CC–5 ×4
HYB25D256800CC–5 ×8
HYB25D256160CC–5 ×16
HYB25D256400CC–6 ×4
HYB25D256800CC–6 ×8
HYB25D256160CC–6 ×16
3-3-3
200
166
DDR400B P-TSOPII-66 —
DDR333
2.5-3-3
143
200
DDR266A
3-3-3
DDR400B P-TFBGA-60
2.5-3-3
166
DDR333
Industrial Temperature Range (–40 °C - +85 °C)
HYI25D256800CT–5
HYI25D256160CT–5
HYI25D256800CT–6
HYI25D256160CT–6
HYI25D256800CC–5
HYI25D256160CC–5
HYI25D256800CC–6
HYI25D256160CC–6
×8
3-3-3
200
166
200
166
DDR400B P-TSOPII-66 —
DDR333
×16
×8
2.5-3-3
3-3-3
×16
×8
DDR400A P-TFBGA-60
DDR333
×16
×8
2.5-3-3
×16
1) HYB and HYI: designator for memory components; 25D: DDR SDRAMs at VDDQ = 2.5 V; 256: 256-Mbit density; 400/800/160: product
variations ×4, ×8 and ×16; C: die revision C; L: low power (available on request); F/C/E/T: package type FBGA (lead & halogen free),
FBGA (lead containing), TSOP (lead & halogen free), and TSOP (lead containing)
Rev. 2.3, 2007-03
6
03062006-8CCM-VPUW
QIMONDA [ QIMONDA AG ]
